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Decapsulation
SEM&EDX
Probe Station Application
EMMI Application
OBIRCH Application
LC Application
IC Grinding:Positioned/None-positioned
De-Gold Bump
X-Ray Application
SAM Application
De-gold bump
De-Gold Bump

Removing the gold bumps rooted in the pads of LCD driver ICs while preserving the integrity of pads for the

convenience of the following analysis or rebonding.

 
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